Indium Corporation’s Tim Jensen, Senior Product Manager, Solder Preform and Thermal Technology, will present on metal thermal interface materials during the IMAPS European Advanced Technology Workshop on Micropackaging and Thermal Management, Feb. 5-6 in La Rochelle, France.
Metal thermal interface materials have played a niche role in thermal applications for many years. Due to their high thermal conductivity, they have the potential to be a high-performing thermal interface material (TIM). Jensen’s presentation, Low Melt Alloy Development for Use as a Thermal Interface Material, reviews how metal TIMs are used today in thermal applications as a solder, compressible pad, liquid metal, phase change material, and solid/liquid hybrids. He’ll also examine how low-melting point alloy TIMs can have broad uses in TIM1 and TIM2 applications where high heat dissipation is required.
Jensen has more than 20 years of experience working with customers troubleshooting and optimizing SMT process lines and solving defects, such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. As Senior Product Manager, Jensen is responsible for Indium Corporation’s most diverse product group, which includes solder preforms, wire, ribbon and foil, as well as thermal interface materials. He has authored numerous process and technical guidelines and has presented at numerous industry forums and conferences. In addition to his responsibilities at Indium Corporation, Tim also serves on the SMTA’s Board of Directors. In this role, he is part of the Strategic Development Committee where he leads the effort on international expansion. He earned his bachelor’s degree in chemical engineering from Clarkson University and his master’s in business administration from Syracuse University.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
