Indium Corporation’s Tim Jensen, Senior Product Manager, Solder Preform and Thermal Technology, will present on metal thermal interface materials during the IMAPS European Advanced Technology Workshop on Micropackaging and Thermal Management, Feb. 5-6 in La Rochelle, France.
Metal thermal interface materials have played a niche role in thermal applications for many years. Due to their high thermal conductivity, they have the potential to be a high-performing thermal interface material (TIM). Jensen’s presentation, Low Melt Alloy Development for Use as a Thermal Interface Material, reviews how metal TIMs are used today in thermal applications as a solder, compressible pad, liquid metal, phase change material, and solid/liquid hybrids. He’ll also examine how low-melting point alloy TIMs can have broad uses in TIM1 and TIM2 applications where high heat dissipation is required.
Jensen has more than 20 years of experience working with customers troubleshooting and optimizing SMT process lines and solving defects, such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. As Senior Product Manager, Jensen is responsible for Indium Corporation’s most diverse product group, which includes solder preforms, wire, ribbon and foil, as well as thermal interface materials. He has authored numerous process and technical guidelines and has presented at numerous industry forums and conferences. In addition to his responsibilities at Indium Corporation, Tim also serves on the SMTA’s Board of Directors. In this role, he is part of the Strategic Development Committee where he leads the effort on international expansion. He earned his bachelor’s degree in chemical engineering from Clarkson University and his master’s in business administration from Syracuse University.
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
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