Indium Corporation’s Aaron Yan, Area Technical Manager, Semiconductor, will present at the SiP Conference China 2019, September 10-11, in Shenzhen, China.
Yan’s presentation, Novel Water-Soluble Flux Study for Heterogeneous Integration Assembly, will detail a high-viscosity, high-tack flux designed to be used to secure components at the placement and reflow stage allowing the flux residue to be cleaned. He will also present the characteristics and strengths of the developed flux, WS-446HF, including its excellent wetting, low voiding performance, and elimination of dendritic residues.
Yan is based in Suzhou, China, and provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, and engineered solders and thermal management materials. He has a bachelor’s degree in Industry and Commerce Administration from Suchow University in China. He is a Certified SMT Process Engineer and has more than 18 years of experience in surface mount technology and semiconductor materials applications.
For more information on Indium Corporation’s materials for heterogeneous integration, visit indiumstg.wpenginepowered.com/HIA or visit Indium Corporation’s booth.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
