Indium Corporation’s Aaron Yan, Area Technical Manager, Semiconductor, will present at the SiP Conference China 2019, September 10-11, in Shenzhen, China.
Yan’s presentation, Novel Water-Soluble Flux Study for Heterogeneous Integration Assembly, will detail a high-viscosity, high-tack flux designed to be used to secure components at the placement and reflow stage allowing the flux residue to be cleaned. He will also present the characteristics and strengths of the developed flux, WS-446HF, including its excellent wetting, low voiding performance, and elimination of dendritic residues.
Yan is based in Suzhou, China, and provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, and engineered solders and thermal management materials. He has a bachelor’s degree in Industry and Commerce Administration from Suchow University in China. He is a Certified SMT Process Engineer and has more than 18 years of experience in surface mount technology and semiconductor materials applications.
For more information on Indium Corporation’s materials for heterogeneous integration, visit indiumstg.wpenginepowered.com/HIA or visit Indium Corporation’s booth.
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
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