Indium Corporations Leo Hu, senior area technical manager East China, will share the challenges and solutions of fine feature solder paste printing for system-in-package (SiP) at SiP Conference China, May 19, Shanghai, China.
Fine feature solder paste printing as an assembly method continues to be a challenge for SiP assembly. Shrinking aperture designs have necessitated the use of fine-powder solder paste, with Types 5, 6, and 7 being commonand an identified need for Type 8 in the future. As more components are backed into these advanced designs, solder paste rheology becomes another important characteristic to consider. In Challenge and Solution of Fine Feature Solder Paste Printing for SiP Assembly, Hu will examine common failure modes in SiP assembly and the technological advances in solder paste formulation and substrate design to help eliminate those failure modes. He will also discuss:
- Proper stencil printer setup to reduce assembly defects with designs-of-experiment outlining which stencil printer parameters are statistically significant in improving process yields of SiP assemblies with fine-powder solder pastes
- The importance of solder paste inspection in identifying assembly defects and the important parameters to optimize to accurately inspect solder paste deposits below 90 microns.
Hu joined Indium Corporation in 2016 and is based in Suzhou, China. He has more than 15 years of experience in semiconductor packaging and is a veteran in advanced assembly technology development, process improvement, and assembly materials applications. Hu has served in many roles at industry-leading outsourced assembly and test (OSAT) companies, including process engineer, project engineer, senior R&D engineer, and chief engineer. He has a masters degree in IC engineering from the Chinese Academy of Science, and a bachelors degree in electronic information science and technology from Nankai University, Tianjin, China.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以透過www.linkedin.com/company/indium-corporation/或@IndiumCorp 追蹤我們的專家，From One Engineer To Another (#FOETA)。
About SiP Conference China
From 2017 to 2021, the SiP Conference China attracted more than 200 international and regional companies. The participation of enterprises has truly realized the construction from SiP China to SiP World, realizing the exchange of cutting-edge technology. After years of industry experience, the 6th SiP China Conference will continue to set up two sub-venues in 2022, Shanghai and Shenzhen, aiming to fully radiate the SiP packaging industry clusters in the Yangtze River Delta and the Pearl River Delta. What’s more, it will meet the needs of the booming 5G, AIoT industry chain, and smart wearables, smart phones, smart cars, data centers, and other product lines.
