Indium Corporations Leo Hu, senior area technical manager East China, will share the challenges and solutions of fine feature solder paste printing for system-in-package (SiP) at SiP Conference China, May 19, Shanghai, China.
Fine feature solder paste printing as an assembly method continues to be a challenge for SiP assembly. Shrinking aperture designs have necessitated the use of fine-powder solder paste, with Types 5, 6, and 7 being commonand an identified need for Type 8 in the future. As more components are backed into these advanced designs, solder paste rheology becomes another important characteristic to consider. In Challenge and Solution of Fine Feature Solder Paste Printing for SiP Assembly, Hu will examine common failure modes in SiP assembly and the technological advances in solder paste formulation and substrate design to help eliminate those failure modes. He will also discuss:
- Proper stencil printer setup to reduce assembly defects with designs-of-experiment outlining which stencil printer parameters are statistically significant in improving process yields of SiP assemblies with fine-powder solder pastes
- The importance of solder paste inspection in identifying assembly defects and the important parameters to optimize to accurately inspect solder paste deposits below 90 microns.
Hu joined Indium Corporation in 2016 and is based in Suzhou, China. He has more than 15 years of experience in semiconductor packaging and is a veteran in advanced assembly technology development, process improvement, and assembly materials applications. Hu has served in many roles at industry-leading outsourced assembly and test (OSAT) companies, including process engineer, project engineer, senior R&D engineer, and chief engineer. He has a masters degree in IC engineering from the Chinese Academy of Science, and a bachelors degree in electronic information science and technology from Nankai University, Tianjin, China.
关于铟泰铟泰公司
铟泰公司是全球电子、半导体、薄膜和热管理市场首屈一指的材料精炼商、冶炼商、制造商和供应商。 产品涵盖焊料与助焊剂、硬焊料、热界面材料、溅射靶材、铟、镓、锗、锡等金属及无机化合物，以及NanoFoil™（ ）。公司创立于1934年，拥有全球技术支持体系，工厂遍布中国、德国、印度、马来西亚、新加坡、韩国、英国及美国。
如需了解更多铟泰公司信息，请访问www.indium.com或发送邮件至黄静雅。您还可关注我们的专家团队"工程师同行"（，#FOETA）的推特账号www.linkedin.com/company/indium-corporation/或@IndiumCorp。
About SiP Conference China
From 2017 to 2021, the SiP Conference China attracted more than 200 international and regional companies. The participation of enterprises has truly realized the construction from SiP China to SiP World, realizing the exchange of cutting-edge technology. After years of industry experience, the 6th SiP China Conference will continue to set up two sub-venues in 2022, Shanghai and Shenzhen, aiming to fully radiate the SiP packaging industry clusters in the Yangtze River Delta and the Pearl River Delta. What’s more, it will meet the needs of the booming 5G, AIoT industry chain, and smart wearables, smart phones, smart cars, data centers, and other product lines.
