Indium Corporation's Maria Durham, Technical Support Engineer for Semiconductor and Advanced Assembly Materials, will present and co-chair a technical session at the International Microelectronics Assembly and Packaging Society (IMAPS) New England Chapter 2015 Symposium and Expo on May 5 in Boxborough, Mass.
The semiconductor assembly industry continues its movement toward finer-pitch materials and reduced copper pillar height. As a result, cleaning processes are increasingly more difficult. Durham's presentation, Ultra-Low Residue (ULR) Semiconductor-Grade Fluxes for Flip-Chip and MEMs Application, discusses the use of semiconductor-grade, ultra-low residue, no-clean fluxes that help meet this industry challenge. Her presentation also discusses the benefits of using ULR no-clean fluxes.
In addition to her presentation, Durham will also serve as a session co-chair for Advanced Technologies for 2.5D/3D Packaging, which will discuss the impact of high-density 3D packages, other aspects of 2.5D/3D integration technology and applications, and copper pillar and underfill challenges.
Durham serves as a technical liaison between Indium Corporation's customers and internal departments, such as sales, technical support, research and development, and operations to guarantee the best quality and selection of products. She earned her bachelor's degree in physics and applied mathematics from Clarkson University in Potsdam, N.Y.
IMAPS is a global community of microelectronic related engineers, scientists, manufacturers, end-users, and supply chain companies. The Society aims to support the development and growth of the microelectronics and related industries, and to aid the transfer of knowledge and information.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
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