Indium Corporation's Maria Durham, Technical Support Engineer for Semiconductor and Advanced Assembly Materials, will present and co-chair a technical session at the International Microelectronics Assembly and Packaging Society (IMAPS) New England Chapter 2015 Symposium and Expo on May 5 in Boxborough, Mass.
The semiconductor assembly industry continues its movement toward finer-pitch materials and reduced copper pillar height. As a result, cleaning processes are increasingly more difficult. Durham's presentation, Ultra-Low Residue (ULR) Semiconductor-Grade Fluxes for Flip-Chip and MEMs Application, discusses the use of semiconductor-grade, ultra-low residue, no-clean fluxes that help meet this industry challenge. Her presentation also discusses the benefits of using ULR no-clean fluxes.
In addition to her presentation, Durham will also serve as a session co-chair for Advanced Technologies for 2.5D/3D Packaging, which will discuss the impact of high-density 3D packages, other aspects of 2.5D/3D integration technology and applications, and copper pillar and underfill challenges.
Durham serves as a technical liaison between Indium Corporation's customers and internal departments, such as sales, technical support, research and development, and operations to guarantee the best quality and selection of products. She earned her bachelor's degree in physics and applied mathematics from Clarkson University in Potsdam, N.Y.
IMAPS是一个由微电子相关领域的工程师 、科学家、制造商、终端用户及供应链企业组成的全球性社区。该学会旨在支持微电子及相关行业的发展与壮大，并促进知识与信息的交流。
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持体系，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
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