Indium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium Corporation Senior Technologist, Dr. Ronald Lasky, will deliver both a workshop and technical presentation at the Electronics in Harsh Environments SMTA Conference on May 14-16 in Copenhagen, Denmark.
The presentation, Electrification & Automotive Power Electronics Innovative High-Reliability Solder Materials, will focus on interconnect solder materials designed to meet the more stringent requirements brought on by increased electrification in automotive and other power electronics applications.
Mission profiles have become harsher with higher service temperatures, increased cycles, and lower Rth, said Vijay. Power module construction is also evolving. This means that the interconnect solder materials for substrate-attach, clip-attach, and module-attach will need to be designed for the newer requirements.
Vijay heads the applications engineering team for customers in Europe, Africa, and the Middle East. His expertise is in automotive, industrial, and RF applications involving PCBA and power electronics, focusing on using different material sets, including solder preforms, solder paste, thermal interface materials, and semiconductor-grade electronics materials. He has more than 20 years of experience in electronics assembly and a masters degree in industrial engineering with a specialization in electronics packaging and manufacturing from the State University of New York, Binghamton. He is a Certified SMT Process Engineer and earned his Six Sigma Green Belt certification from Dartmouth Colleges Thayer School of Engineering. Vijay is active in several industry organizations, including IMAPS and SMTA, and has presented at several industry forums and conferences nationally and internationally.
Indium Corporation Senior Technologist Dr. Ronald Lasky will deliver a workshop and presentation at the conference:
1. Testing and Evaluation Solders for Reliability in Harsh Environments
2. Thermal Interface Materials (TIMs): Their Status and Applications 2024
The Testing and Evaluation workshop is an intermediate-level workshop that will cover all of the factors in the selection and implementation of a solder paste for high reliability and yields in harsh environments.
Dr. Lasky is a senior technologist at Indium Corporation, a professor of engineering at Dartmouth College, and a Lean Six Sigma Black Belt instructor. He has more than 30 years of experience in electronics and optoelectronics packaging at IBM, Universal Instruments, and Cookson Electronics. Dr. Lasky has authored six books and contributed to nine others on science, electronics, and optoelectronics; he has authored numerous technical papers. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses, such as electronics packaging, materials science, physics, mechanical engineering, and science and religion.
Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams that set worldwide standards in the electronics assembly industry. Dr. Lasky was awarded the Surface Mount Technology Associations (SMTA) Technical Distinction Award in 2021 for his significant and continuing technical contributions to the SMTA. He was also awarded SMTAs prestigious Founders Award in 2003.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
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