The upcoming Electronics Packaging Technology Conference (EPTC) will feature presentations by two Indium Corporation experts. The conference, which takes place December 79 in Singapore, covers the complete spectrum of electronics packaging technology.
Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, will deliver a presentation titled Low-Temperature Material for First-Level Interconnect in Semiconductor Packaging, which is an initiative under the iNEMI Packaging TIG and co-authored with colleagues from IBM Corporation, Nihon Superior Co. LTD., and others. The focus of the presentation is whether low-temperature materials (LTM) being used in other levels of electronics assembly could also be used for first level interconnects in semiconductor packaging, and if there is enough driving force for implementing this use. It includes not only the interconnects to the processor but also those to all the functional elements in the package of which the processor is a part.
R&D Sintering Project Manager, Demi Yao, will present findings from a paper titled Pressure Copper Sintering Paste for High-Power Device Die-Attach Applications. This presentation focuses on the development of a copper (Cu) sintering paste with high shear strength, high thermal and electrical conductivity, and positive reliability for high-power device die-attach applications. The paste is suitable for different metallizations, e.g., Au, Ag, and Cu. After more than 1,000 hours (250C) aging and 3,500 cycles TCT (-40175C), the joints exhibited excellent performance without delamination. Shear strength increased with increased TCT cycles. This Cu sintering paste can be used for both dispensing and printing applications.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以透過www.linkedin.com/company/indium-corporation/或@IndiumCorp 追蹤我們的專家，From One Engineer To Another (#FOETA)。
