Indium Corporation experts will share their knowledge and expertise at IMAPS 50th International Symposium on Microelectronics, Oct. 10-12, in Raleigh, NC.
Vice President of Technology Dr. Ning-Cheng Lee will teach a professional development course, Choosing Solders for the New Era: Low-Cost High-Reliability Solder Alloys. This course explores the roles of solder composition in relation to cost and reliability, including materials properties, soldering performance, known failure modes, and the primary merit of discussed alloys.
Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will co-chair a session on polymers in microelectronics (WA5). This session focuses on the development of polymers for use as encapsulates, dielectrics, conductors, and resistors for use in microelectronic devices.
Tim Jensen, Product Manager for Engineered Solders Materials, will present Reinforced Solder Technology for Increased Reliability. The presentation details the outcomes of a study that showed how, through an optimized design, a reinforced solder preform can produce a solder joint with high-reliability and low-voiding.
Jensen will also co-chair a session on reliability (THA5). This session focuses on several facets of electronics reliability that are impacted as devices generate more power from smaller form factors in broader ranges of applications.
To register for the IMAPS conference, visit: www.imaps.org/imaps2017.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
