Indium Corporation experts will share their knowledge and expertise at IMAPS 50th International Symposium on Microelectronics, Oct. 10-12, in Raleigh, NC.
Vice President of Technology Dr. Ning-Cheng Lee will teach a professional development course, Choosing Solders for the New Era: Low-Cost High-Reliability Solder Alloys. This course explores the roles of solder composition in relation to cost and reliability, including materials properties, soldering performance, known failure modes, and the primary merit of discussed alloys.
Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will co-chair a session on polymers in microelectronics (WA5). This session focuses on the development of polymers for use as encapsulates, dielectrics, conductors, and resistors for use in microelectronic devices.
Tim Jensen, Product Manager for Engineered Solders Materials, will present Reinforced Solder Technology for Increased Reliability. The presentation details the outcomes of a study that showed how, through an optimized design, a reinforced solder preform can produce a solder joint with high-reliability and low-voiding.
Jensen will also co-chair a session on reliability (THA5). This session focuses on several facets of electronics reliability that are impacted as devices generate more power from smaller form factors in broader ranges of applications.
To register for the IMAPS conference, visit: www.imaps.org/imaps2017.
Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil®。Indium 公司成立于 1934 年，在中国、马来西亚、新加坡、韩国、英国和美国拥有全球性的技术支持和工厂。
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