Indium Corporation experts will share their technical insight and knowledge on automotive and electric vehicle (EV) materials solutions as part of an e-Mobility forum at PCIM Europe, May 10-12, Nuremberg, Germany.
In power electronics soldering applications, precise assembly alignment is critical to achieve reliable performance and repeatable manufacturing. Alignment tools and fixtures are effective in maintaining alignment, but are complex and expensive. Until now, alternative methods of leveraging tacking materials to affix the assembly required tradeoffs in soldering quality, process windows, and long-term equipment maintenance.
In his presentation, Emerging Tacking Material Technology Improves Flux-Free Soldering Quality in EV Power Module Applications, Joe Hertline, product manager ESM/power electronics, will explore an emerging material technology for formic acid/vacuum soldering processes that are common in EV power electronics. InTACK is a flux-free solution that maintains precise alignment over an extended working time while achieving high-quality soldering performance and avoiding extra cleaning or maintenance processes for production.
Hertline will also participate in a poster session, where he will discuss the impact of how manufacturing processes related to soldered and sintered power modules have strong influence on costs, reliability, and lifetime of the products. Reliance on complex, costly alignment tooling is growing as power module designers seek improved reliability performance. In Novel Material Technology Reduces Tool and Fixturing Complexity for Solder Preforms in Power Module Assembly, he will share how InTACK delivers exceptional soldering and sintering results without post-process cleaning steps.
Indium Corporations Dean Payne, product manager semiconductor, will give a vendor presentation on Pb-Free Die-Attach Materials for Power Discrete Components and Power Modules. Indium Corporation embodies the belief that material science changes the world. This presentation will introduce some of Indium Corporations most recent material developments and the benefits they bring to power electronics packaging. These products include a high-temperature lead-free solder solution capable of outperforming high-Pb solder in die-attach and clip-attach applications in power discrete packages and small multi-chip module packages. Another material development is pressure Ag sinter paste for die-attach applications in power module assemblies for EV/hybrid electric vehicle traction inverters.
Hertline is a product manager for engineered solder materials, focusing on power electronics applications. He is responsible for driving the growth of the power electronics product line through development and implementation of marketing strategies supported by customer experience, emerging technologies, and industry feedback. He also collaborates with Indium Corporations sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market. Hertline earned a bachelors degree in mechanical engineering and an MBA from Clarkson University in Potsdam, N.Y.
Payne is a product manager for semiconductors, responsible for driving profitable growth of Indium Corporations power semiconductor materials, which include high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. He collaborates with internal departments, including sales, technical service, R&D, production, and quality, and provides support for all semiconductor and advanced assembly materials. Payne is based at Indium Corporations Asia-Pacific Operations in Singapore. Payne has more than 13 years of experience in semiconductor/wafer fabrication. Prior to that, he worked as a photolithography process engineer for an international semiconductor assembly and test facility, where he analyzed data, updated process specifications, and supervised process engineers. He holds multiple certifications from the University of Wales and Coleg Gwent in the United Kingdom, including the Level 3 National Vocational Qualification in electrical and electronic engineering, the Higher National Certificate in electrical and electronic engineering, and the Higher National Diploma in engineering.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以透過www.linkedin.com/company/indium-corporation/或@IndiumCorp 追蹤我們的專家，From One Engineer To Another (#FOETA)。
關於 PCIM 歐洲
PCIM Europe is the worlds leading exhibition and conference for power electronics, intelligent motion, renewable energy, and energy management. Learn more at pcim.mesago.com.
