The upcoming SMTA China East Technical Conference will feature presentations by four Indium Corporation experts. The conference, which takes place July 19-20, is being held in conjunction with NEPCON China at the Shanghai World Expo Exhibition & Convention Center. In addition to presenting, Senior Area Technical Manager East China Leo Hu will serve as Conference Chairman for the July 20 sessions.
Indium Corporation experts will share the following presentations:
- 7月19日
- Fine Powder Investigation for Optimum Imperial 008004 SP Printing: Part I, presented by Area Technical Manager East China Leon Rao, 10:4511:20
- Ultra-Low-Residue Flux Application in RF Front End Packaging, presented by Senior Area Technical Manager East China Leo Hu, 14:5515:30
- July 20
- Ultrafine Solder Paste Dispensing for Heterogeneous Integration, presented by Area Technical Manager East China Joey Qiao, 10:4511:20
- How to Solve LGA Voiding Through Process Optimization, presented by Senior Area Technical Manager East China Leo Hu, 13:4514:20
The SMTA China East Technical Conference, held in conjunction with NEPCON China 2023, will address the industry’s most pressing issues in Advanced Packaging/Components, Assembly Business/Supply Chain, Emerging Technologies, Harsh Environment Applications, PCB Technology, Process Control, and Soldering Processes.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
