The upcoming SMTA China East Technical Conference will feature presentations by four Indium Corporation experts. The conference, which takes place July 19-20, is being held in conjunction with NEPCON China at the Shanghai World Expo Exhibition & Convention Center. In addition to presenting, Senior Area Technical Manager East China Leo Hu will serve as Conference Chairman for the July 20 sessions.
Indium Corporation experts will share the following presentations:
- 7月19日
- Fine Powder Investigation for Optimum Imperial 008004 SP Printing: Part I, presented by Area Technical Manager East China Leon Rao, 10:4511:20
- Ultra-Low-Residue Flux Application in RF Front End Packaging, presented by Senior Area Technical Manager East China Leo Hu, 14:5515:30
- July 20
- Ultrafine Solder Paste Dispensing for Heterogeneous Integration, presented by Area Technical Manager East China Joey Qiao, 10:4511:20
- How to Solve LGA Voiding Through Process Optimization, presented by Senior Area Technical Manager East China Leo Hu, 13:4514:20
The SMTA China East Technical Conference, held in conjunction with NEPCON China 2023, will address the industry’s most pressing issues in Advanced Packaging/Components, Assembly Business/Supply Chain, Emerging Technologies, Harsh Environment Applications, PCB Technology, Process Control, and Soldering Processes.
インジウム・コーポレーションについて
インジウム・コーポレーション は、世界のエレクトロニクス、半導体、薄膜、サーマルマネージメント市場向けの一流の材料精製、製錬、製造、サプライヤーである。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil などがある。1934年に設立され、グローバルな技術サポートと中国、ドイツ、インド、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
