Several Indium Corporation experts will share their knowledge and expertise at the SMTA International Technical Conference, Sept. 17-21 in Rosemont, Ill.
The following technical papers from Indium Corporation experts will be featured:
- Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications by Dr. Ning-Cheng Lee, Vice President of Technology
- Nano-Cu Sintering Paste for High Power Devices Die-Attach Applications by Dr. Ning-Cheng Lee
- RoHS Eleven Years Later: How Has it Gone? by Dr. Ronald C. Lasky, Senior Technologist
Indium Corporation experts will also lead technical sessions, including:
- Advanced Packaging Technology Track – Session APT2 – BTC Leadless: Anny Zhang, Regional Sales Manager, Northwestern USA and Western Canada
- Manufacturing Excellence Track – Session MFX2 – Printing: Tim Jensen, Product Manager for Engineered Solders Materials
- Flux, Solder, Adhesives Track – Session FSA5 – Low-Melting Alloy: Adam Murling, Global Accounts Manager
- Flux, Solder, Adhesives Track – Session FSA3 – Flux Reliability: Eric Bastow, Assistant Technical Manager, Americas Region
SMTAI is a world-class electronics manufacturing conference and exhibition organized by the SMTA — the world's leading user group for surface mount and companion technologies. The conference provides high-quality technical information and networking opportunities.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
