Several Indium Corporation experts will share their knowledge and expertise at the SMTA International Technical Conference, Sept. 17-21 in Rosemont, Ill.
The following technical papers from Indium Corporation experts will be featured:
- Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications by Dr. Ning-Cheng Lee, Vice President of Technology
- Nano-Cu Sintering Paste for High Power Devices Die-Attach Applications by Dr. Ning-Cheng Lee
- RoHS Eleven Years Later: How Has it Gone? by Dr. Ronald C. Lasky, Senior Technologist
Indium Corporation experts will also lead technical sessions, including:
- Advanced Packaging Technology Track – Session APT2 – BTC Leadless: Anny Zhang, Regional Sales Manager, Northwestern USA and Western Canada
- Manufacturing Excellence Track – Session MFX2 – Printing: Tim Jensen, Product Manager for Engineered Solders Materials
- Flux, Solder, Adhesives Track – Session FSA5 – Low-Melting Alloy: Adam Murling, Global Accounts Manager
- Flux, Solder, Adhesives Track – Session FSA3 – Flux Reliability: Eric Bastow, Assistant Technical Manager, Americas Region
SMTAI is a world-class electronics manufacturing conference and exhibition organized by the SMTA — the world's leading user group for surface mount and companion technologies. The conference provides high-quality technical information and networking opportunities.
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
