Indium Corporation will feature its Indium8.9HF and Indium10.1 solder pastes at NEPCON South China 2015, on Aug. 25-27, in Shenzhen, China.
Pb-free, halogen-free Indium8.9HF is perfectly suited for a wide variety of applications, including automotive, consumer, and communications. This is due to its high print transfer efficiency and robust reflow process window capability. With reliable performance and stability during usage, a clear, probe-testable flux residue, and a resilient oxidation barrier for strong head-in-pillow and graping resistance, Indium8.9HF is Indium Corporation’s best all-round halogen-free solder paste.
Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes. The oxidation-inhibiting properties of Indium10.1 provide industry-leading head-in-pillow and graping resistance, with complete coalescence, even after long reflow profiles. The exceptional soldering ability of Indium10.1 makes it the best solution for components with less-than-ideal solderability, and challenging RF shield metallizations.
For more information about Indium8.9HF, Indium10.1 or the Indium Pb-free series of solder pastes, visit indiumstg.wpenginepowered.com/indium8.9series or visit Indium Corporation at A-1L25.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
