Indium Corporation will feature its InFORMS® ESM02, a reinforced solder fabrication designed to produce consistent bondline thickness for die-level attach applications, at PCIM 2019, May 5-7, Nuremberg, Germany.
Indium Corporation’s InFORMS® ESM02 is a reinforced matrixed solder composite that produces a high-reliability solder joint with increased thermal and mechanical performance for the development of new, or the improvement of existing, applications.
Previous InFORMS® technology was only applied at the baseplate level; however, new production capabilities have expanded its use to the die-level with a bondline of 50μm. Other benefits of InFORMS® include:
- 可直接取代其他鍵線控制方法
- 增加側向強度
- 鍵線共面性
- 提高熱循環可靠性
- Availability in ribbon and preforms
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
