Indium Corporation will feature its WS-575-C Ball-Attach Flux at Microelectronics Tech Asia Singapore, July 4-5, 2017 in Singapore.
Indium Corporation’s WS-575-C Ball-Attach Flux is halogen-compliant (“no-intentionally-added” halogens) and designed as a true one-step ball-attach process for Cu OSP substrates. WS-575-C eliminates many assembly issues, such as missing ball, weak joints, and voiding.
WS-575-C can be completely cleaned using room temperature deionized (DI) water, significantly reducing the costs of heating water.
For more information on WS-575-C Ball-Attach Flux , visit indiumstg.wpenginepowered.com/ballattachflux or visit Indium Corporation at booth 14.
如需進一步了解 Indium Corporation，請造訪indiumstg.wpenginepowered.com或發送電子郵件至 [email protected]。您也可以在www.facebook.com/indium或@IndiumCorp 追蹤我們的專家團隊「From One Engineer ToAnother®」（#FOETA）。
