Indium Corporation is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the companys Durafuse mixed-alloy technology. Durafuse HR is a patent-pending alloy system that delivers enhanced thermal cycling performance and superior voiding performance without vacuum reflow, especially for high-reliability automotive applications.
Engineered to withstand 3,000+ thermal cycles at -40C/125C across different PCB finishes and component types, Durafuse HR is ideal for applications requiring an extended mission profile beyond what is achievable with traditional Pb-free alloys. No longer does high-reliability have to mean high-voiding, as Durafuse HR outperforms SAC305 when it comes to bottom-terminated component voiding. It also offers reduced solder joint cracking and increased shear strength.
At Indium Corporation, we believe that materials science changes the world, said Senior Product Manager Chris Nash. In that spirit, we believe that Durafuse HR has the ability to revolutionize automotive soldering processes and numerous other high-reliability applications. Durafuse HR features: High-temperature thermal cycling reliability Excellent voiding performance Good shear strength Compatible with most SAC305 reflow profiles Compatible with standard PCB surface finishes, including ImSn, OSP, and ENIG For more information about Indium Corporations solder alloy products, visit www.indium.com/solders/alloys.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以在www.linkedin.com/company/indium-corporation/ 追蹤我們的專家，From One Engineer To Another (#FOETA)。
