Indium Corporation is announcing the release of InTACK, a drop-in, robust tacking agent for power module assembly at PCIM Europe, May 10-12, Nuremberg, Germany.
InTACK is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, creating a low-cost tooling-free solution without compromising soldering quality. While InTACK has the tack strength to hold materials in place, the material is completely evaporated out during reflow, eliminating the time-consuming post-reflow residue cleaning steps.
InTACK technology is specifically designed to achieve high-quality solder performance with no residue in flux-free reflow techniques commonly used in power module assembly. Benefits of InTACK include:
- Maintains precise assembly alignment
- Compatible with solder preforms, dies, and power module components
- Robust tacking and long working time
- Optimal performance in formic acid/vacuum reflow
- No residue, no cleaning
- Dispensing application tested and process proven
如需 InTACK 的詳細資訊，請聯絡 Indium Corporation ESM/Power Electronics 產品經理Joe Hertline。
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
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