CLINTON, N.Y., April 14, 2026 — Indium Corporation® Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics Manufacturing Initiative (INEMI) project comparing SnBi and SAC305 solder alloys for first-level interconnects in complex heterogeneous packages. The session will be conducted at the International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS), April 14-17, in Hiroshima, Japan.
The presentation, Thermal Stress Study of Low Temperature Material for 1st Level Interconnect, will demonstrate how SnBi solder interconnects provide superior dimensional stability—reducing warpage by 70+ microns through lower processing temperatures—while matching SAC305’s proven thermal aging and shock resistance. These results enable optimized material selection for next-generation high-performance, high-density semiconductor packages requiring exceptional thermomechanical reliability. Indium Corporation Metallurgist Danyang Zheng and five other INEMI collaborators contributed to the study.
As Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim works closely with Indium Corporation’s internal sales and R&D teams to develop solutions for industry needs and requirements. She also collaborates with external customers and corporate partners to support the industry’s move toward heterogeneous integration. Some of her recent work includes the development of materials and processes for advanced packaging for fine feature printing for SiP applications, as well as for one-step OSP ball-attach applications.
ICEP-HBS visitors can attend Lim’s presentation on Wednesday, April 15, at 9:00 a.m. JST. To learn more about Indium Corporation’s semiconductor packaging and assembly solutions, visit indium.com.
關於 Indium Corporation
IndiumCorporation®是全球電子、半導體、薄膜及熱管理市場中首屈一指的材料精煉商、冶煉商、製造商及供應商。 產品涵蓋焊料與助焊劑、釬料、熱界面材料、濺鍍靶材、銦、鎵、鍺及錫的金屬與無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球技術支援網絡，並在中國、德國、印度、馬來西亞、新加坡、南韓、英國及美國設有工廠。
如需進一步了解 Indium Corporation，請造訪indiumstg.wpenginepowered.com或發送電子郵件至 [email protected]。您也可以在www.linkedin.com/company/indium-corporation/ 追蹤我們的專家團隊「From One Engineer ToAnother®」（#FOETA）。
