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Indium Corporation Releases Video on Indium Tin Oxide’s Impact on Touchscreen Technology

Indium Corporation's Dr. Ron Lasky, Senior Technologist, discusses the importance of indium tin oxide (ITO) in touchscreen and flat panel technology in a new video available at www.indium.com/blog/phil-zarrow.

As part of the Electronics Assembly with Phil Zarrow series, Lasky and SMT manufacturing expert Phil Zarrow, President and Principal Consultant for ITM Consulting, review how ITO is used to enable flat panel and touchscreen technologies.

"Indium metal and ITO are among the most important materials in the modern world," according to Lasky. "The very nature of metals is that they're opaque; it's a matter of physics. So, scientists had to find a material that both conducts electricity and is transparent – and ITO is the solution. ITO's transparency enables flat panel displays and touchscreen technology."

For more information on indium, high purity indium, and indium alloys, visit www.indium.com/metals/indium.

Dr. Lasky, holder of the prestigious SMTA Founder's Award, is a world-renowned process expert and a Senior Technologist at Indium Corporation. He is also a Professor of Engineering and the Director of the Cook Engineering Design Center at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronic packaging and assembly. Dr. Lasky has authored six books, and contributed to nine more on science, electronics, and optoelectronics. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion. Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams that set standards in the electronics assembly industry, worldwide. Dr. Lasky also authors a technology blog, which can be found at www.indium.com/drlasky.

Zarrow 從事 PCB 製造和組裝已超過 35 年。除了在自動化組裝和清洗方面的背景之外,Zarrow 在表面貼裝回流焊接技術、SMT 貼片設備和回流焊接系統的設計和實施方面的專業知識也獲得了認可。他豐富的實務經驗還包括在世界各地設置通孔和 SMT 製程並排除故障。

Indium Corporation 是全球電子、半導體、薄膜、熱管理和太陽能市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物,以及 NanoFoil®。Indium 成立於 1934 年,擁有全球性的技術支援,工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。

如需更多關於 Indium Corporation 的資訊,請造訪www.indium.com或寄電子郵件[email protected]您也可以透過www.facebook.com/indium@IndiumCorp 追蹤我們的專家,From One Engineer ToAnother®(#FOETA)。