CLINTON, N.Y., October 2, 2026 — Indium Corporation® Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will explore how combining innovative solder materials with optimized reflow oven technology can reduce energy consumption at the Expo for Electronics Manufacturing (EFX), October 6-8, in Stuttgart, Germany.
The presentation, Energy Efficiency in the Soldering Process, developed in partnership with SMT Thermal Discoveries, will demonstrate a collaborative approach to reducing energy consumption and emissions in electronics assembly. The session will examine Indium Corporation’s Durafuse® LT mixed powder alloy, which reflows at approximately 200–210°C, and SMT Thermal Discoveries’ SMT R320 convection reflow oven, designed to optimize heat transfer and energy efficiency. Testing demonstrated the potential of combining the two technologies, with Durafuse® LT reflowed in the SMT R320 achieving a 25% reduction in power consumption, annual energy costs, and CO₂ emissions compared with SAC305 reflowed in a standard reflow oven.
Andreas Karch provides technical support to customers in Germany, Austria, and Switzerland, sharing process knowledge, technical guidance, and application recommendations for Indium Corporation’s complete portfolio of solder paste, solder preforms, fluxes, and thermal management materials.
EFX 2026 visitors can attend the presentation on October 6, 13:00 CEST. To learn more about Indium Corporation’s Durafuse® Technology, visit indium.com or meet with our experts at EFX Booth 9A79.
關於 Indium Corporation
IndiumCorporation®是全球電子、半導體、薄膜及熱管理市場中首屈一指的材料精煉商、冶煉商、製造商及供應商。 產品涵蓋焊料與助焊劑、釬料、熱界面材料、濺鍍靶材、銦、鎵、鍺及錫等金屬與無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球技術支援網絡，並在中國、德國、印度、馬來西亞、墨西哥、新加坡、南韓、英國及美國設有工廠。
如需了解更多關於 Indium Corporation 的資訊，請造訪www.indium.com或發送電子郵件至[email protected]。您也可以在www.linkedin.com/company/indium-corporation/ 上追蹤我們的專家團隊「From One Engineer ToAnother®」（#FOETA）。
