CLINTON, N.Y., October 2, 2026 — Indium Corporation® Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will explore how combining innovative solder materials with optimized reflow oven technology can reduce energy consumption at the Expo for Electronics Manufacturing (EFX), October 6-8, in Stuttgart, Germany.
The presentation, Energy Efficiency in the Soldering Process, developed in partnership with SMT Thermal Discoveries, will demonstrate a collaborative approach to reducing energy consumption and emissions in electronics assembly. The session will examine Indium Corporation’s Durafuse® LT mixed powder alloy, which reflows at approximately 200–210°C, and SMT Thermal Discoveries’ SMT R320 convection reflow oven, designed to optimize heat transfer and energy efficiency. Testing demonstrated the potential of combining the two technologies, with Durafuse® LT reflowed in the SMT R320 achieving a 25% reduction in power consumption, annual energy costs, and CO₂ emissions compared with SAC305 reflowed in a standard reflow oven.
Andreas Karch provides technical support to customers in Germany, Austria, and Switzerland, sharing process knowledge, technical guidance, and application recommendations for Indium Corporation’s complete portfolio of solder paste, solder preforms, fluxes, and thermal management materials.
EFX 2026 visitors can attend the presentation on October 6, 13:00 CEST. To learn more about Indium Corporation’s Durafuse® Technology, visit indium.com or meet with our experts at EFX Booth 9A79.
关于铟泰铟泰公司
铟泰公司®是面向全球电子、半导体、薄膜及热管理 市场的顶级材料精炼商、冶炼商、制造商和供应商。 产品包括焊料和助焊剂；硬钎焊 ；热界面材料；溅射靶材 ；铟、镓（Ga） 、锗和锡金属及无机化合物 ；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度 、马来西亚 、墨西哥 、新加坡 、韩国、英国和美国设有工厂。
如需了解有关“铟泰公司 ”的更多信息，请访问www.indium.com或发送电子邮件至[email protected]。您还可以通过www.linkedin.com/company/indium-corporation/ 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
