Indium Corporation’s Dr. Ron Lasky, Senior Technologist, and Sze Pei Lim, Semiconductor Product Manager for Asia, will present at Pan Pacific Microelectronics Symposium 2018 (Pan Pac) in Hawaii, Feb. 5-8, 2018.
Dr. Lasky’s presentation, Using Cpk and Cpk Confidence Intervals to Evaluate Stencil Printing, will discuss a new technique to calculate 95% confidence intervals on Cpk, including an Excel® spreadsheet developed to calculate Cpk and its confidence intervals. He will also detail the difference between data being statistically significant and practically significant. In addition to his presentation, Dr. Lasky will serve as chairperson for a session on Advanced Materials.
Lim’s presentation, Challenges in Material Selection for SiP Applications, will discuss recommended guidelines for selecting appropriate solder pastes and flip-chip fluxes based on System-in-Package (SiP) design and requirements within the packaging industry. Her presentation will also present testing results.
Lasky 博士是著名的 SMTA 創辦人獎得主，也是世界知名的製程專家和 Indium Corporation 的資深技術專家。他也是 Dartmouth College 的工程教授和 Cook 工程設計中心主任。他在電子和光電封裝和組裝領域擁有超過 30 年的經驗。Lasky 博士撰寫了六本書，並參與了九本關於科學、電子和光電子的書籍。此外，他還在多所大學擔任兼職教授，教授 20 多門不同的課程，主題涵蓋電子封裝、材料科學、物理學、機械工程與科學，以及宗教。Lasky 博士擁有多項專利，並開發了多項與成本估算、產線平衡和製程最佳化相關的 SMT 處理軟體產品。他是工程認證考試的共同創造者，這些考試為全球電子組裝產業設定了標準。
Lim has more than 20 years of experience in the PCB assembly and semiconductor packaging industries and is highly respected in her field. She earned her bachelor’s degree in chemistry from the National University of Singapore, is an SMTA-certified process engineer, and has a Six Sigma Green Belt. Lim joined Indium Corporation in 2007.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
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