Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at IMAPS 2018, Oct. 8-11 in Pasadena, Calif.
Indium Corporation is redefining solder with its InFORMS® solder preforms. InFORMS® are a composite preform consisting of solder with a reinforcing matrix. This results in:
- Improved mechanical and thermal reliability
- Uniform bondline thickness
- Low-voiding performance
InFORMS® do more than just bond two surfaces.
These solder preforms are designed to address some
specific challenges to the power electronics industry.
InFORMS®為工程師開發更可靠、更高性能的模組提供了增強的材料。由於平面度的改進和stand-off 公差，封裝設計變得更可預測。此外，更堅固、更可靠的接點可實現高功率密度。
For more information about InFORMS®, visit indiumstg.wpenginepowered.com/informs or visit us at booth #722.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
