As an industry leader in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation will feature innovative material solutions designed to meet the evolving challenges of SiP and HIA at the 55th International Symposium on Microelectronics (IMAPS) from Oct. 3-6 in Boston, Mass., U.S.
Indium Corporations proven SiPaste series is specifically designed for fine-feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void, reduce slumping, and demonstrate consistent superior printing performance. Water-soluble SiPaste 3.2HF has been adopted by leading OSATs and has been used in more than 5 billion mobile FEM SiP modules. The newly released SiPaste C201HF offers the same superior printing performance with the benefit of having a cleanable chemistry with semi-aqueous-based solutions.
As the industry leader in no-clean semiconductor flux, Indium Corporation will also feature the first low-residue no-clean, ball-attach flux on the market, NC-809. NC-809 is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications and with adequate wetting power for ball-attach applications. This material is designed to hold die or solder spheres in place without risk of die shift or solder sphere movement during the assembly process.
NC-809 is designed to leave minimal residue after reflow, at the level of Indium Corporations proven ultra-low residue (ULR) flip-chip fluxes such as NC-26S and NC-699. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes. NC-809 also improves production yields by eliminating costly cleaning steps which can increase substrate warpage both after reflow and before the underfilling steps, creating the potential for die damage and cracked solder joints.
NC-809 offers:
- 高粘度可消除回流過程中的晶片傾斜或移位；大幅減少電氣開路故障
- 穩定的助焊劑沉澱和優異的潤濕性
- 超低殘留物；是製造緊密間距倒轉晶片組件的客戶的理想選擇
- 與多種填充劑相容
- 由於沒有清洗步驟，封裝翹曲減少，熱應力降低
關於 Indium Corporation
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以透過www.linkedin.com/company/indium-corporation/或@IndiumCorp 追蹤我們的專家，From One Engineer To Another (#FOETA)。
About IMAPS
The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Societys portfolio of technologies is disseminated through premier professional events, an exclusive microelectronics packaging research library, local chapter networks, and other efforts. Founded in 1967 as ISHM, then merging with the International Electronic and Packaging Society (IEPS) in 1996, the Society has over 50 years of networking, education, and publication history.
