Indium Corporation will feature its Die-Attach “Power-Safe” NC-SMQ®75 Solder Paste at China Semiconductor Packaging & Test Seminar (CSPT) 2018, Nov. 19-21 in Hefei, Anhui, China.
NC-SMQ®75 is an ultra-low residue, halogen-free, die-attach solder paste that leaves a completely benign, almost undetectable residue.
NC-SMQ®75's unique formulation has been proven in demanding high-reliability applications, and features:
- Ultra-low post-reflow residue <0.5% w/w of solder paste
- “Power-Safe” residue compatible with overmolding compounds without delamination
- Consistently good wetting with common metal finishes
- Dispenses without clogging for powder types 3, 4, 5, and 6
- Wide range of alloy compatibility, including high-Pb alloys
Along with NC-SMQ®75, Indium Corporation has a wide array of proven die-attach products to cater to multiple applications, such as system-in-package, flip-chip, and more. Please see our experts on the show floor or visit indiumstg.wpenginepowered.com to learn more.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
