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Indium Corporation to Host Webinar on Material Technology for Power Module Soldering and Sintering

Indium Corporation‘s Joe Hertline, Product Manager for Engineered Solder Materials (ESM)/Power Electronics, will host a webinar to discuss an emerging material technology which has the ability to provide robust tacking strength while reducing dependency on customized fixturing. The webinar, a part of the company’s InSIDER Series, will be held live at 8:30 a.m. (EST), Tuesday, February 28 and made available for on-demand viewing afterward. 

Reliance on complex, costly alignment fixturing is growing as power module designers seek repeatable manufacturing and to achieve high-reliability performance. Flux-free soldering techniques are being deployed widely to meet the increasing requirements for quality, low voiding, and cleanliness driven by automotive/EV use cases. The emergence of sintering materials for SiC module applications are also a key consideration as manufacturers look at opportunities to scale processes and leverage high-performance properties. 

In this webinar, Hertline will present how InTACK material technology can be applied during assembly to provide robust tacking strength and reduce dependency on customized fixturing. The absence of residue and contamination with InTACK make it a viable option for flux-free soldering and sintering applications where cleanliness directly influences reliability performance. Test data will be analyzed to evaluate material characteristics for dispensing, tack strength, and post-processing, and case studies will be reviewed to demonstrate opportunities for reduced process steps, cycle time, and overall cost of ownership in power module manufacturing.

You can register for Hertline’s webinar at: InTackWebinar. The webinar link will be shared with registrants the day of the event. Registrants must use a company email account to avoid Indium Corporation’s spam filters. This is a first-come, first-served event.

Hertline is the Product Manager for ESM, focusing on power electronics applications. He is responsible for driving the growth of the power electronics product line through development and implementation of marketing strategies supported by customer experience, emerging technologies, and industry feedback. Hertline also collaborates with Indium Corporation’s sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market. He earned a bachelor’s degree in mechanical engineering and an MBA from Clarkson University and is a Certified SMT Process Engineer (CSMTPE).

關於 Indium Corporation

Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物,以及 NanoFoil 。公司成立於 1934 年,擁有全球性的技術支援,工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。

如需更多關於 Indium Corporation 的資訊,請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以透過www.linkedin.com/company/indium-corporation/@IndiumCorp 追蹤我們的專家,From One Engineer To Another (#FOETA)。