Indium Corporation, the industry leader for void-reducing solutions, will chair a special session focusing on void reduction in bottom-terminated components (BTCs) at the SMTA International Conference on Sept. 29 in Rosemont, Ill.
Voiding is of critical concern in today's electronics assembly arena, especially in BTCs, due to impacts on electrical, thermal, and mechanical performance.
Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will moderate BTC Void Reduction For Yield and Performance Enhancement, which will focus on reliability, materials, reflow, and inspection. Raiyo Aspandiar of Intel Corporation will co-chair the session.
The following presentations will offer participants information and best practices to Avoid the Void™:
- Component and Solder Joint Reliability With Voiding by Dave Hillman, Rockwell Collins;
- Materials to Mitigate Voiding in Electronics Assembly by Dr. Ron Lasky, Indium Corporation Senior Technologist;
- Reflow Strategies to Minimize Voiding by Dave Heller, Heller Industries;
- Accurate Reflow Profiling to Minimize Voiding by Marybeth Allen, KIC
- X-Ray Inspection Strategies to Accurately Characterize Voiding by Keith Bryant, YXLON International
SMTAI is a world-class electronics manufacturing conference and exhibition organized by the SMTA — the world's leading user group for surface mount and companion technologies. The conference provides high-quality technical information and networking opportunities.
Indium Corporation 是全球電子、半導體、薄膜、熱管理和太陽能市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
