Indium Corporation‘s Principal Engineer and Manager for Thermal Interface Materials Applications Dr. Andy Mackie, Ph.D., will deliver a webinar presentation as part of the International Electronics Manufacturing Initiative’s (iNEMI) Packaging Tech Topic Series on Tuesday, March 28.
Dr. Mackie’s presentation will address the evolution of power electronics packaging, focusing in particular on advancements in assembly and thermal interface materials. The webinar will cover the challenges and solutions associated with power electronics packaging, and the impact of emerging technologies such as silicon carbide (SiC) and gallium nitride (GaN) and the new challenges they pose. Dr. Mackie will also provide an in-depth analysis of the different types of materials used in power electronics packaging, their advantages, and limitations, as well as share insight into the future direction of power electronics packaging and the potential for further advancements in assembly and thermal interface materials to enable more efficient and reliable power electronic systems.
“As power electronics become increasingly important in modern electronic systems, it is essential for the industry to understand the packaging challenges we face, as well as the critical role that assembly and thermal interface materials have to play in addressing those challenges,” said Mackie. “I want to thank iNEMI for giving me the platform to share my experiences and help our industry move forward.”
The webinar is open to all industry professionals (iNEMI membership is not necessary); advance registration is required. Click here to register.
Dr. Mackie is an electronics industry expert with a technical background in physical chemistry, surface chemistry, rheology, and semiconductor fabrication and assembly materials and processes. His professional experience covers all aspects of electronics manufacturing from wafer fabrication to semiconductor packaging and SMT/electronics assembly. In his current role, he is focused on identifying thermal material needs and trends for various high-performance applications, as well as the development and testing of innovative solutions to meet the emerging thermal interface material requirements. Dr. Mackie has been an invited international keynote speaker and has lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to solder paste rheology. He holds patents in novel polymers, heterogeneous catalysis, and solder paste formulation. Dr. Mackie holds a Ph.D. in physical chemistry from the University of Nottingham, UK, and a Master’s of Science (MSc) in colloid and interface science from the University of Bristol, UK.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以透過www.linkedin.com/company/indium-corporation/或@IndiumCorp 追蹤我們的專家，From One Engineer To Another (#FOETA)。
About iNEMI
The International Electronics Manufacturing Initiative (iNEMI) is a not-for-profit, highly efficient R&D consortium of 86 leading electronics manufacturers, suppliers, associations, government agencies, and universities. Its mission is to be the premier collaboration forum to forecast and accelerate improvements in the electronics manufacturing industry. iNEMI roadmaps the future technology requirements of the global electronics industry, identifies and prioritizes technology and infrastructure gaps, and helps eliminate those gaps through timely, high-impact deployment projects.
