Indium Corporation's Tim Jensen, senior product manager for engineered solders, will share his expertise during two Surface Mount Technology Association (SMTA) Webtorials on March 18 and 25 from 1-2:30 p.m. EST.
Jensen's presentation, Process Optimization and Defect Elimination for PCB Assembly, includes a detailed discussion of soldering materials, components, and PCBs that will provide the important aspects needed to produce a complete electronics product that meet current and future legislative restrictions.
Jensen is an SMTA-certified process engineer. He has more than 15 years of experience working with customers troubleshooting and optimizing SMT process lines and solving defects such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely with Indium Corporation's technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. As a product manager, Jensen is responsible for Indium Corporation's most diverse product group, which includes solder preforms, wire, ribbon, and foil, as well as thermal interface materials. He earned his bachelor's degree in chemical engineering from Clarkson University and his master's in business administration from Syracuse University.
SMTA Webinars and Webtorials provide opportunities to learn about the latest information on electronics assembly and advanced packaging without leaving the office. For more information or to register, visit www.smta.org/education/presentations/presentations.cfm.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家 From One Engineer ToAnother®(#FOETA) 。
