Indium Corporation's Tim Jensen, senior product manager for engineered solders, will share his expertise during two Surface Mount Technology Association (SMTA) Webtorials on March 18 and 25 from 1-2:30 p.m. EST.
Jensen's presentation, Process Optimization and Defect Elimination for PCB Assembly, includes a detailed discussion of soldering materials, components, and PCBs that will provide the important aspects needed to produce a complete electronics product that meet current and future legislative restrictions.
Jensen is an SMTA-certified process engineer. He has more than 15 years of experience working with customers troubleshooting and optimizing SMT process lines and solving defects such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely with Indium Corporation's technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. As a product manager, Jensen is responsible for Indium Corporation's most diverse product group, which includes solder preforms, wire, ribbon, and foil, as well as thermal interface materials. He earned his bachelor's degree in chemical engineering from Clarkson University and his master's in business administration from Syracuse University.
SMTA Webinars and Webtorials provide opportunities to learn about the latest information on electronics assembly and advanced packaging without leaving the office. For more information or to register, visit www.smta.org/education/presentations/presentations.cfm.
Indium Corporation 是全球电子、半导体、太阳能、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil®。Indium 公司成立于 1934 年，在中国、马来西亚、新加坡、韩国、英国和美国拥有全球性的技术支持和工厂。
有关 Indium Corporation 的更多信息，请访问www.indium.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家 From One Engineer ToAnother®(#FOETA) 。
