Two Indium Corporation experts are set to present at APEC 2023, March 19-23, in Orlando, FL. Senior Research Chemist Dr. Sihai Chen will present a technical poster titled Highly Reliable Silver Sintering Joints for Power Module Applications, while Product Manager Joe Hertline will deliver a presentation titled A Novel Material Technology that Reduces Tooling Dependency and Process Complexity in Power Module Soldering and Sintering Applications.
Dr. Chen’s poster presentation will address the development of silver sintering for high-reliability power modules necessitated by the large-scale production of EVs. Currently used high-lead solder bonding materials cannot meet the criteria for power module assembly, especially under high CTE mismatch conditions. However, silver sintering paste bonded between materials with different CTE mismatches achieved high reliability tested by TST (-65C150C, 3min./3min., liquid-to-liquid).
Hertline will present on a novel material technology which, applied during assembly, provides robust tacking strength to reduce the dependency on customized fixturing. The technology reduces process time, energy input, and tooling complexity while minimizing up-front thermal stress applied to the device components, yielding an overall manufacturing cost of ownership reduction for high-reliability power modules. It provides a solution to the growing reliance on complex, costly alignment fixturing as power module designers seek repeatable manufacturing and to achieve high-reliability performance.
Dr. Chen specializes in silver sintering paste product development and has authored several of Indium Corporation’s patents for silver sintering paste, thermal interface materials, heat dissipating paint, and indium bump bonding. Dr. Chen has been published in many of the world’s leading scientific journals, including the Journal of the American Chemical Society, Nano Letters, Langmuir, and The Journal of Physical Chemistry. He has also been a reviewer for some of these publications. Dr. Chen obtained his doctorate in chemistry from the Chinese Academy of Sciences with a focus on metal and semiconductor nanomaterial synthesis. Prior to joining Indium Corporation, he conducted research at Clemson University and Duke University. Dr. Chen also has extensive research experience in nanomaterials in Germany (Max-Plank Gesellschaft scholarship recipient) and Japan (JSPS fellow), as well as in the U.S. He holds a Six Sigma Green Belt and is certified as an IPC Specialist for IPC-A-610.
Hertline 負責透過以客戶經驗、新興技術及產業回饋為支撐的行銷策略的開發與執行，推動電力電子產品線的成長。Hertline 也與 Indium Corporation 的銷售、技術支援、研發、生產及品質團隊合作，在其指定的市場服務現有客戶並開拓新業務。他擁有 Clarkson University 的機械工程學士學位和 MBA 學位，並且是 SMT 製程認證工程師 (CSMTPE)。
To learn more about Indium Corporation’s innovative products for EV and power electronics, visit us at booth #859 at APEC or online at indium.com.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以透過www.linkedin.com/company/indium-corporation/或@IndiumCorp 追蹤我們的專家，From One Engineer To Another (#FOETA)。
關於 APEC
應用電力電子會議 (APEC) 著重於電力電子業務的實務和應用方面。APEC 課程涵蓋各種電力電子設備的使用、設計、製造和行銷方面的廣泛主題。高品質的專業教育研討會、完整的參考論文，以及人潮洶湧的展覽廳，每年都能提供無價的教育。
