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Indium Corporation is a leading gold and silver alloy bonding and brazing materials innovator for high-temperature and high-reliability applications, such as die-attach and hermetic sealing, in various industries including automotive, RF infrastructure, military, laser, and aerospace.
With over 200 alloys available, we have alloy solutions for temperatures up to 1,100°C. Providing an alternative to traditional high-lead options, Indium Corporation currently offers and is continuously developing novel lead-free solutions such as gold solders, sintering, preforms, and alloy technology with new flux systems
High Temperature Products
Lead-free options from Indium Corporation
Gold based alloys offer strong bond strength, excellent corrosion and oxidation resistance, and good thermal and electrical transfer at the braze joint.
Indium Corporation’s QuickSinter® silver sintering pastes are high metal-loading materials designed to fit easily into a dispense process with no change of deposition equipment. The pastes can also use fast “reflow-like” (RFL) sintering processes to form strong joints on many standard leadframe, DBC, and IPM pad finishes, and will bond strongly to die with Ag, Au, or Cu surfaces.
Silver-Based High Temp Alloys
High thermal and electrical conductivity, capillaries very well into joints, and holds up well in applications with lots of stress and with CTE mismatches.
|Gold-Based Alloys||Strong bond strength, excellent corrosion and oxidation resistance, and good thermal and electrical transfer at the braze joint.||Indalloy®200 (100Au)
Solidus 451°C / Liquidus 485°C
Solidus 278°C / Liquidus 332°C
Solidus 278°C / Liquidus 301°C
Solidus 278°C / Liquidus 289°C
|Silver-Based Alloys||High thermal and electrical conductivity, capillaries very well into joints, and holds up well in applications with lots of stress and with CTE mismatches.||Braze Indalloy®B962 (99.99Ag)
Indalloy®193 (72Ag / 28Cu)
Braze Indalloy®B6851 (63Ag / 27Cu / 10In)
Solidus 685°C / Liquidus 730°C
|Comments||Sn||Ag||Sb||Au||Bi||Ge||Solidus (°C)||Liquidus (°C)|
|Lower Tj IGBT usage||96.5||3.5||221°C||Eutectic|
|Also known as "J-alloy"||65||25||10||233°C||Eutectic|
|Commonly used in step-soldering processes||95||5||237°C||240°C|
|Highest Sb content possible in standard Sn/Sb wire||91.5||8.5||241°C||248°C|
|Commonly used in step-soldering processes||90||10||243°C||257°C|
|Highest melting standard Sn/Sb alloy||86||14|
|Very poor solder-ability||11||89||262°C||360°C|
|Very high tensile strength and thermal / electrical conductivities||20||80||280°C||Eutectic|
|Usable for very high Tj die-attach such as SiC||88||12||356°C||Eutectic|