Indium Blog

2020 SPIE Photonics West Show

  • AuSn
  • Die Attach
  • Solder Preforms

  • The SPIE Photonics West trade show in San Francisco, CA (Feb 4-6) is only one week away! The show is focused on emerging technologies related to optics and photonics. This is one of our biggest shows in Northern California for our high-temperature and brazing materials, and we look forward to networking with our customers and learning about new applications within this exciting market.

    Indium Corporation will be promoting our AuLTRA™ ThInFORMS™, premium AuSn preforms for die-attach applications. Our AuLTRA™ ThInFORMS™ improve thermal transfer and overall operational efficiency in die-attach applications, as well as help to reduce voiding and wicking up the die. 

    SPIE, the international society for optics and photonics, was founded in 1955 to advance light-based technologies. Serving more than 255,000 constituents from 183 countries, the not-for-profit society advances emerging technologies through interdisciplinary information exchange, continuing education, publications, patent precedent, and career and professional growth. SPIE annually organizes and sponsors approximately 25 major technical forums, exhibitions, and education programs in North America, Europe, Asia, and the South Pacific.

    Please stop by to see us at booth #4584, and while you're at it, ask us about our Quick Turn Program for new Au preform designs for prototypes. Let us know how we can help you with future projects!