Tips to Speed Your Solder and Flux Selection
Today I made my rounds in the office, collecting ideas for you from our tech guys – ideas to help you speed the alloy and flux s...
Die Attach
Understanding Gold on Nickel
The use of gold layers deposited onto nickel is standard in many industries, from DRAM memory module edge connectors, to electrical test probe co...
Coefficient of Thermal Expansion, CTE Mismatch: Indium and Indium alloys
Materials to be used in packaging of high power semiconductor devices are often chosen by their coefficient of thermal expansion, or CTE. For ins...
INTERVIEW: Dr Jennie Hwang: World-Renowned Solder Expert
Dr Jennie Hwang I recently had the opportunity to discuss several issues in Pb-free die-attach and other solder applications with Jennie Hwang Ph...
Controlling Junction Temperature of LEDs with Thermal Management Materials
The junction temperature in an LED (the p-n junction temperature) is most critical to consider for LED cooling. If this temperature rises above t...
ELV Legislation Update (I)
Under-the-Hood: The “Death Valley” of Power Electronics New insights in April into changes in the European ELV (End-of-life vehi...
What's Your Pb-Free Replacement for High Pb Alloys In Die-Attach?
Solder Die Attach Image Courtesy of memsonics.com The clock is ticking before the extension of Pb-free legislation for high Pb-containi...
Theory of “Ball Drop” Sphere Placement
After transferring flux, align the stencil Setup print parameters to minimize doubles and......
IGBT Assembly - Indium8.9LDA Solder Paste
The Insulated Gate Bipolar Transistor (IGBT) module is rapidly taking over from MOSFET technology as the solid-state power switch of choice. Die-attac...
Predictions for 2009: Advanced Packaging
The folks at Advanced Packaging magazine asked Indium Corporation for its predictions for the Standard Semiconductor and Power Semiconductor packaging...
Solderability Testing of Die-Attach Solder Paste
Diagram of Solder-Dipping Test Apparatus Solder-wetting Curve ......
Semiconductor Packaging Industry Trends for 2009
A recent interview with Andy Mackie,(Ph.D., Indium Corporation)in Advanced Packaging Magazine helped shed some light......