Why Blog?
Rick Short shaving my head for charity So why Blog? Whatever I choose to call this thing that you are currently reading, it’s a Blog. But what.....
Rick Short shaving my head for charity So why Blog? Whatever I choose to call this thing that you are currently reading, it’s a Blog. But what.....
A small selection of our Pb-free solder alloys In possibly one of the quietest revolutions in the history of Power Semiconductor electronics manufactu...
Welcome to the Power Semiconductor Assembly Blog, Indium Corporation’s information watercooler for the Power Semiconductor assembly industry. So...
Seth Homer is a Product Support Specialist for Engineered Solder Materials. He’s like a Green Beret or Navy Seal of solder preforms...
Etched Indium Ribbon Wound Back on Itself and cold-welded to form a loop. Die assembly often involves......
Michael Qiu of Indium Corporation f eqn="sum 0 1 0"></f><f eqn="sum 0 0 1">f eqn="prod 2 1 2">&...
Anyone working with BGA solder joint reliability should be used to X-ray detection, made possible by Si-Li and Ge-Li......
Unacceptable voiding under a die With less voiding under a power die, more heat can be dissipated through the solder into......
We are looking into a way to deposit solder on a typical die attach machine without using die-attach paste – and without a tooling change. This...
Soft solders are used instead of hard solders in applications were there are large coefficient of thermal expansion mismatches between semiconductor d...
If you need me to troubleshoot your ball attach process, PoP process, flip-chip assembly process, or die-attach process, I’d be happy to come an...
The picture shows a “Dispensing Component Kit”. I find this is extremely helpful in quickly verifying your powder/needle combination. This...