Flux Challenges Regarding Flip-Chip/BGA Balling
This video is for anyone interested in the flux challenges associated with flip-chip/BGA balling. Keywords: Phil Zarrow, Andy Mackie, Indium Corporati...
Dr. Andy Mackie's Blog
The Materials Behind Internet of Things
This video is for electronics assemblers looking to the future of the Internet of Things. It will cover the types of technology and the materials nece...
No-Clean Fluxes in Semiconductor Assembly
We explore cleaning techniques for Internet of Things (IoT) devices. It will cover water-soluble and no-clean materials and process....
Causes and Solutions to Voiding in Die-Attach
This video is for engineers challenged by voiding in die-attach electronics assembly applications. It covers causes and methods to Avoid the Void®...
Voiding in Die-Attach Electronics Assembly
This video is for people who are trying to select or develop the proper reflow profile for a die-attach process. It will tell you the differences betw...
Metal Loading in Solder Paste - A Review (Part 1)
Three IPC test methods are used to guarantee to customers that they are getting the same material (within agreed tolerances). However o...
Materials Lifetimes - A Modest Proposal
Specific and consistent terminologies are required to enable accurate and effective discussions of soldering materials....
Die-Attach Soldering Using Indium Alloys
There are at least three significant reasons to use indium solder alloys in your die-attach operation: Physical performance, Supplier reliability, Mat...
ELV 2014: High-Lead (Pb) in Automotive Electronics is Good until at Least 2023
Those of you who have been watching this blog for a while - waiting for updates on the European ELV (End of Life Vehicle) legislation - wait no m...
Ultralow Residue Flip-Chip Fluxes: Semicon Taiwan
It’s often helpful to overhear good things being said about you. I attended a supplier meeting in Los Angeles in March, and overheard two senior...
Effect of Package and Die Size on Dipping and Pick-up
While in South East Asia last summer, Indium’s technical team and I had a chance to discuss flip-chip dipping processes with a major equipment v...
Choosing a Leadframe or DBC Finish for Die-Attach in Power Devices
Solderability and Wetting The wetting and spreading of solder onto surfaces is an essential part of forming a strong, reliable, conductive joint. The ...