RDSON and Solder Volume Resistivity
Interesting question from a Chinese die-attach customer this week asking about volume resistivity of solder. My friend, Eric Bastow, suggested that In...
Dr. Andy Mackie's Blog
Marcy Nanocenter Semiconductor Fab
You may remember that, a couple of years ago, I wrote an article for Chip Scale Review magazine about plans for a major semiconductor facility (the Ma...
Reflow of Copper Pillar Microbumps
Wafer bumping processes have evolved in the last 10 years. The semiconductor assembly industry has gone from bumping processes using solder paste prin...
Leadframe Solderability Issues in Power Semiconductors
It is no secret that automotive semiconductor customers are becoming increasingly demanding. The “under the hood / bonnet” electronics env...
Ball-Attach Flux WS-446-NRD for Poor Quality OSP-wetting
While on a recent trip to Malaysia, I interviewed two colleagues regarding trends in semiconductor assembly. My previously-published interview with Sz...
No-Clean Solder Paste for Clip-bonding Die-Attach
I’m just back from Malaysia, where I visited one of our larger customers who has been using our high-lead (high-Pb) dispensable N...
Semiconductor Pictorial Roadmap: Semicon West 2012
One of the things that bring customers over to our semiconductor tradeshow booths, year after year, is the pictorial roadmap. This is the diagram ...
Indium-Lead (In/Pb) Solder Alloys for Reliable Gold Interconnects in Semiconductor Assembly
Maria Durham, Indium’s new Technical Specialist in Semiconductor and Advanced Assembly Materials, has been doing some research on indium lead (I...
iMAPS Automotive - Dearborn, Michigan: May 22-23, 2012
The iMAPS Automotive 2012 steering committee would like to invite you to participate in the 2012 conference (May 22-23, 2012) to be held in Dearborn, ...
Central New York — Waiting in the Wings for Semiconductor Assembly?
The following appeared in a slightly different form as an editorial in Chip Scale Review magazine’s online edition. ============================...
Solder Paste and Flux Dip Depth: II
Following on from our discussions of last time... As you will recall from the previous post on this topic, My friend and colleague Chris Nash and I w...
Solder Paste and Flux Dip Depth: I
My friend and colleague Chris Nash and I were recently discussing some puzzling results for low dip height found during testing of package-on-pac...