Wafer and Substrate Bumping with Solder Paste (II)
… and we’re back on the question of “how small a solder powder particle do I need, to achieve a certain bump height or bump diameter...
… and we’re back on the question of “how small a solder powder particle do I need, to achieve a certain bump height or bump diameter...
This week’s topic is both wafer bumping and substrate bumping with solder paste, and the issue of powder size. I’ve recently been dea...
My friend and colleague, Eric Bastow, got back last month from an IPC standards meeting with some interesting news for those of us who supply and use ...
Andy’s 10 Rules for Presentations I spent this morning discussing presentations with a younger colleague, and realized that I may have some poin...
Solderspheres or solder spheres, or even solder balls: whatever you call them, Indium Corporation has been making them for years and has rightly acqui...
I mentioned in a previous a blog posting that the primary driver for halogen-free electronics is ostensibly environmental, but that the confusion abou...
Those of you have been watching this blog for a while will know that I’ve been keeping tabs on the status of the European ELV (End-of-life vehic...
I caught up with Alan Rae after a recent IWLPC committee meeting, where he jokingly asked me to, “Stop asking important questions” –...
Just before the New Year, I had the opportunity to sit down with my old friend and colleague Dr Conrad Sorenson. Conrad is an expert in the fusion of ...
Forming gas is a complicated topic, so I will provide some preliminary background in this section, then get into the soldering part next time. Don&rsq...
The use of gold layers deposited onto nickel is standard in many industries, from DRAM memory module edge connectors, to electrical test probe co...
Many of you know that my brother, Wing Commander Kevin Mackie, returned from his tour of duty in Khandahar, Afghanistan, at the beginning of this year...