Flat Surfaces for the NanoBond® Soldering Process
As mentioned in a separate post, uniform pressure across a NanoBond® interface is critical for maximum solder bond strength. Uniform pressure is m...
As mentioned in a separate post, uniform pressure across a NanoBond® interface is critical for maximum solder bond strength. Uniform pressure is m...
The first time I was taught how to solder (as a child), I was told: “All the surfaces need to be mechanically cleaned and chemically cleaned.&rd...
The first step of the NanoBond® process should usually happen long before the NanoFoil® arrives at your facility. DFM (design for manufacturin...
The 27th European Photovoltaic Solar Energy Conference and Exhibition is back in Germany again this year. I’m looking forward to seeing my frien...
While on a recent trip to Malaysia, I interviewed two colleagues regarding trends in semiconductor assembly. My previously-published interview with Sz...
One of the biggest misconceptions about NanoFoil® is that it is a form of solder. While it may contain a solder coating if specified (usually tin)...
Ultrasonic Testing (UT), performed by acoustic microscopy, is a great way to determine the quality of a solder bond without destroying the assembly. ...
To successfully use NanoFoil®, you do not need to fully understand what it is or how it is made, although that does help. It also makes for a...
I received some interesting news last week: a company that produces solar powered electric pontoon boats has moved their operation from Canada to Rome...
When helping customers with the optimization of their soldering process, the question often comes up; “What will my solder bond line thickn...
The Indium Corporation has developed a new solder research kit designed specifically to meet the needs of medical manufacturers who are soldering to N...