Electromigration (EM) and Electrochemical Migration (ECM)
I was asked this week to contribute to the upcoming IPC handbook (IPC-CH-65 HDBK) on the section on contamination and its effects on printed wiring as...
Semiconductor Packaging
Things I Learned at IWLPC 2010
Once again, here are some things I learned at this year’s IWLPC show 2010 in Santa Clara. Picture below taken at Philadelphia airport,...
Solder Powder Types 3 4 5 6 7…
My friend and colleague, Eric Bastow, got back last month from an IPC standards meeting with some interesting news for those of us who supply and use ...
Unique Solderspheres
Solderspheres or solder spheres, or even solder balls: whatever you call them, Indium Corporation has been making them for years and has rightly acqui...
Lead (Pb) in ELV Solder: European Automotive Electronics Legislation - Feb 2010 Update
Those of you have been watching this blog for a while will know that I’ve been keeping tabs on the status of the European ELV (End-of-life vehic...
Dr. Alan Rae: Nanotechnology in Electronics Assembly
I caught up with Alan Rae after a recent IWLPC committee meeting, where he jokingly asked me to, “Stop asking important questions” –...
High Thermal Conductivity of Metal
At some point we have all had experiences which convinced us that metals have a high thermal conductivity. It may have been the hot spoon you lef...
Galvanic Corrosion of Unusual Solder Alloys
I have been asked on numerous occasions to calculate the potential for galvanic corrosion between metals. Most times, when I am approached with t...
Solder Pros Mention Indium PoP Paste
Two big names in electronics assembly (Vern Solberg and Phil Damberg) recently wrote an article for Circuits Assembly Magazine regarding &ld...
Indium to Discuss Green Electronics Manufacturing
Register at GlobalSpec to see Andy Mackie, Jim Hisert and me discuss various aspects of Green Electronics Manufacturing. This live ev...
Understanding Gold on Nickel
The use of gold layers deposited onto nickel is standard in many industries, from DRAM memory module edge connectors, to electrical test probe co...