Predictions for 2009: Advanced Packaging
The folks at Advanced Packaging magazine asked Indium Corporation for its predictions for the Standard Semiconductor and Power Semiconductor packaging...
Semiconductor Packaging
Indium Week
Just for fun, I’m declaring this ‘Indium Week” for the Semiconductor Packaging Blog. Even if you don’t currently......
Semiconductor Packaging Industry Trends for 2009
A recent interview with Andy Mackie,(Ph.D., Indium Corporation)in Advanced Packaging Magazine helped shed some light......
A Halogen-Free Interview with Tim Jensen
Tim Jensen is one of the leading experts on the “green” movement. Tim hosts the Halogen-Free Blog......
Semiconductor Packaging Blog – What’s This All About Anyway?
This year started with a small target: to bring you information about soldering materials and processes used in advanced semiconductor......
Liquid Metal Thermal Interface Materials 1
A drop of liquid metal. img src="http://www.indium.com/_images/1116/liquid_metal_thermal_interface_materials_gallium_aluminum_reaction_corrosive_...
Who Reads the Semiconductor Packaging Blog?
The last 100 Semiconductor Blog readers came from across the globe. I’m glad to say this matches the concentration......
Thermal Interface Materials
Liquid Metal Thermal Interface Materials Dispensing Thermal Grease. Image Courtesy of computershopper.com ......
An Interview with Michael Qiu 采访邱学丞
Michael Qiu of Indium Corporation f eqn="sum 0 1 0"></f><f eqn="sum 0 0 1">f eqn="prod 2 1 2">&...
Andy Mackie at Semicon West 2008
Dr. Andy Mackie, Product Manager for Indium’s Semiconductor Packaging Materials span style="font-size: 10pt; font-family:......
Pin Transfer Basics
This is the shape of flux deposits left after pin transfer Spheres attached after pin transfer Pin transfer is a way......