Predictions for 2009: Advanced Packaging
The folks at Advanced Packaging magazine asked Indium Corporation for its predictions for the Standard Semiconductor and Power Semiconductor packaging...
The folks at Advanced Packaging magazine asked Indium Corporation for its predictions for the Standard Semiconductor and Power Semiconductor packaging...
Just for fun, I’m declaring this ‘Indium Week” for the Semiconductor Packaging Blog. Even if you don’t currently......
A recent interview with Andy Mackie,(Ph.D., Indium Corporation)in Advanced Packaging Magazine helped shed some light......
Tim Jensen is one of the leading experts on the “green” movement. Tim hosts the Halogen-Free Blog......
This year started with a small target: to bring you information about soldering materials and processes used in advanced semiconductor......
A drop of liquid metal. img src="http://www.indium.com/_images/1116/liquid_metal_thermal_interface_materials_gallium_aluminum_reaction_corrosive_...
The last 100 Semiconductor Blog readers came from across the globe. I’m glad to say this matches the concentration......
Liquid Metal Thermal Interface Materials Dispensing Thermal Grease. Image Courtesy of computershopper.com ......
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Dr. Andy Mackie, Product Manager for Indium’s Semiconductor Packaging Materials span style="font-size: 10pt; font-family:......
This is the shape of flux deposits left after pin transfer Spheres attached after pin transfer Pin transfer is a way......