Solder Alloy Powder Misconceptions
For a change of pace, again, I have asked another Technical Support Engineer, Chris Nash, to comment about powder sizes. Chris is the Regional T...
SMT Solder
Solder Paste Dipping for PoP and Rework
What’s the difference between Package-on-Package (PoP) / BGA rework solder paste, and solder paste designed for SMT? ......
Meet The Bloggers – An Interesting Mix
As mentioned last week, we are holding another Meet The Bloggers at SMTAI on Aug. 20th. If you are......
Zestron
Dr. Harald Wack of Zestron img src="http://www.indium.com/_images/0725/zestron_cleaning_ball_attach_flux_wafer_2.jpg" alt="Weve lea...
TIM Materials in Auto Devices
Mike Fenners article of soldering in automotive devices can be found in the June edition of OnBoard Technology ......
REFLOW: The secret to a high tensile strength! (Part 1)
At a recent customer visit, I had the opportunity to discuss “the process”. What we typically call “the process”,......
Package-on-Package Process; an interview with Jim Hisert
Package-on-Package (PoP) use in the SMT process is slowly creeping from a niche application into mainstream use. From experience, I know that s...
InTEGRATED Solder Preforms
Have you ever had to hand-place solder washer preforms on the pins of a connector and found it to be very labor intensive? Indium Corporation has a pr...
Package-on-Package Placement (3/5)
Stacking Package-on-Package components is one of the easiest parts of the assembly process. Although each Package-on-Package solder paste and Package-...
PoP - Ready, Set, Reflow!
Package-on-Package processing steps can create delays in getting to the reflow process. If you are new to stacking components, consider the mainstream...
Increasing Costs of Commodities Only a 2nd Order Effect on Electronics
Folks, There has recently been concern over the raising price of commodities (e.g.: copper, tin, silver, gold, cement, steel, oil, lumber, etc). So it...