This video is for electronics assemblers that are seeking the correct wave soldering profile, as well as optimal line balancing. This includes real-wo...

Posted On: April 8th, 2016 | By: Phil Zarrow & Dr. Ron Lasky

Improve SMT Stencil Printing using StencilCoach®

This video is for electronics assembly engineers, technicians, and managers that are seeking to improve SMT stencil printing. It includes details abou...

Posted On: March 14th, 2016 | By: Karthik Vijay

80Au20Sn: Superior Physical Properties

In my previous post we saw that 80Au/20Sn eutectic alloy performs as both a solder or a braze. This is due to its unique and valuable properties. Let&...

Posted On: August 24th, 2015 | By: Dr. Ron Lasky

Handbook of Electronic Assembly Now Available

Folks, It is hard to imagine, but it has been just a little short of 13 years ago that Jim Hall, Phil Zarrow and I approached SMTA’s JoAnn Strom...

Posted On: July 27th, 2015 | By: Tim Jensen

Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBTs: Part I

The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe and Liam Mills of TT Electroni...

Posted On: July 24th, 2015 | By: Adam Murling

What is an Intern to Do?

The Indium Corporation has many summer interns this year. The technical support group was fortunate enough to hire Sarah Bjornland (pictured). She is ...

Posted On: July 22nd, 2015 | By: Indium Corporation®

Solder Reflow Equipment Options

Most of our customers use whatever heating method they already have, unless they are starting from scratch or unless there is a reason their existing ...