Posted On: February 28th, 2018 | By: Dr. Ron Lasky

SMTA Pan Pacific: Electronics for Harsh Environments - "The Next Big Thing in Electronics"

Automotive harsh environments may be the next “big thing” in electronics....

Posted On: January 31st, 2018 | By: Dr. Ron Lasky

Join Me at SMTA Pan Pacific February 5-8

Folks, I am giving a paper, chairing a session and hosting a panel at SMTA Pan Pacific on Februrary 6, 2018 at the Hapuna Beach Prince Resort in Hawai...

Posted On: January 30th, 2018 | By: Phil Zarrow

Tech Seconds with Phil Zarrow: Setting Up a Blind Solder Materials Comparison Study

In this installment of Tech Seconds, Phil outlines the steps for conducting an effective blind solder materials comparison. ...

Posted On: June 7th, 2017 | By: Seth Homer

Solder Redefined Part 4 – Baseplate to Heat-Sink

At Indium Corporation, we're redefining how we use solder at the die-attach, DBC to baseplate, and baseplate to heat-sink levels so we can achieve...

Posted On: June 6th, 2017 | By: Seth Homer

Solder Redefined Part 3 – DBC Substrate to Baseplate

As we've discussed, there are three attach levels of peak concern in the IGBT stack up. At Indium Corporation, we're redefining how we use sol...

Posted On: June 5th, 2017 | By: Seth Homer

Solder Redefined Part 2 – Die-Attach

As discussed in video one of this four video series, there are three attach levels of peak concern in the IGBT stack up. By redefining how we use sold...

Posted On: June 2nd, 2017 | By: Seth Homer

Solder Redefined Part 1 – Introduction

In this series, Seth explores considerations for redefining solder at three attach levels of peak concern in the IGBT stackup: the die level, the subs...