Starvation Voids: When too little (paste) becomes too much (voiding)
Diving deeper into exploring the types of voids and how they occur, some important interactions between material and process variables appear....
Diving deeper into exploring the types of voids and how they occur, some important interactions between material and process variables appear....
Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow, discuss approaches for reaching near zero voiding and how v...
Kim Flanagan, Technical Support Engineer, and Phil Zarrow discuss how to Avoid the Void® by looking at four non-QFN void types—Kirkendall (c...
Andreas Karch reviews how you can Avoid The Void® with Indium8.9HF Solder Paste ...
Voiding is a major problem in electronics assembly, especially in high-temp applications ...
Gold-tin eutectic solder can be used as the second-step solder, after the initial die-attach step. ...
Using gold-tin solder in high-temp applications for both high-temperature and LED applications, there's been an increase in voiding which may corr...
Interview with Sze Pei Lim at Productronica China 2017. ...
This is the last in a series of blog posts that discusses reinforced Solder Preforms for high–reliability and low voiding. Today's focus is ...
This video is for anyone interested in the causes and effects of voiding in solder paste. Keywords: Phil Zarrow, Glen Thomas, askus@indium.com, voidin...
Voiding in flux-cored wire causes serious problems. Learn about the causes of voiding and a way to Avoid The Void®...
Looking for a way to Avoid the Void® using high-quality cored wire? Click here....
In a previous blog I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram.&nbs...
Learn how to reduce voiding in electronics assemblies through the use of proper process and materials. ...
This video is for engineers challenged by voiding in die-attach electronics assembly applications. It covers causes and methods to Avoid the Void®...
This video is for people who are trying to select or develop the proper reflow profile for a die-attach process. It will tell you the differences betw...
Let’s see what’s up with Patty….. Patty was just dropped off at O’Hare airport after finishing a 3 day workshop on Lean Six S...
Voiding is a complex problem with complex solutions. It isn't always just a matter of switching out the solder paste and finding the solution.&nbs...
For process engineers hoping to reduce voiding in electronics assembly, watch as I discuss the reliability of Indium10.1 and Indium8.9HF and how they ...
Watch as I discuss voiding in thermal management and how you can Avoid the Void®....
Watch as I discuss the challenge of voiding in bottom-terminated components - and how to Avoid the Void®....