Indium Corporation expert Seth Homer, Product Manager, Engineered Solders, will present at International Microwave Symposium from June 2-7, in Boston, Massachusetts, USA.
Homer will present Materials and Techniques for Void Reduction Under Bottom Termination Components. The paper discusses how voiding is challenging demands for increased reliability and performance, especially as the industry moves toward new 5G platforms. As a solution to excessive voiding between the thermal pad on the QFN and PWB pad, he examines how Indium Corporation’s flux-coated solder preforms have been used to significantly reduce voiding while providing extra benefits to enhance final product reliability.
Homer has worked with Indium Corporation for more than 25 years, serving in both manufacturing operations and marketing roles. He is responsible for many of the products within the engineered solders product offering especially as it relates to the IGBT and power electronics industries. He travels to customer sites globally to gain industry insight and works closely with Indium Corporation’s manufacturing teams to help support current production demand and future product development.
For more information on Indium Corporation’s flux-coated solder preforms, visit indiumstg.wpenginepowered.com/flux-coated-preforms or visit Indium Corporation’s booth #691.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがある。1934年に設立され、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
インジウム・コーポレーションに関する詳細については、indiumstg.wpenginepowered.comをご覧いただくか、[email protected] までメールでお問い合わせください。また、当社の専門家による「From One Engineer ToAnother®（#FOETA）」を、www.facebook.com/indiumまたは@IndiumCorp でフォローすることもできます。
